80N80-VS mos管、场效应管
80V/80A N-Channel Advanced Power MOSFET
Features
♦Low On-Resistance ♦Fast Switching ♦ 100% Avalanche Tested ♦ Repetitive Avalanche Allowed up to Tjmax ♦Lead-Free, RoHS Compliant ♦
Description
80N08ATD designed by the trench processing techniques to achieve extremely low on-resistance. Additional features of this design are fast switching speed and improved repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in Power supply applications.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only;and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Symbol Parameter Rating Unit
Common Ratings (TC=25°C Unless Otherwise Noted) V
Gate-Source Voltage ±20 V GS
Maximum Junction Temperature 150 °C TJ
T Storage Temperature Range -55 to 150 °C STG
Diode Continuous Forward Current 80 A TC=25°C IS
Mounted on Large Heat Sink
IDM 320 A Pulse Drain Current Tested TC=25°C 80 TC=25°C
IContinuous Drain Current (VGS=10V) A D
64 TC=100°C
260 W TC=25°C
PD Maximum Power Dissipation
140 W TC=100°C
Thermal Resistance-Junction to Case 0.80 °C/W RθJC
R
Thermal Resistance Junction-Ambient 62.5 °C/W θJA
Drain-Source Avalanche Ratings EAS Avalanche Energy, Single Pulsed 800 mJ
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Absolute Maximum Ratings
上海万芯电子科技有限公司Shanghai WanXin Technology and Electronic Co..Ltd80N08ATD
80V/80A N-Channel Advanced Power MOSFET
Symbol Parameter Condition
Min Typ Max Unit Static Electrical Characteristics @ TJ = 25°C (unless otherwise stated)
V(BR)DSS IDSS IGSS
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current(Tc=25℃) Zero Gate Voltage Drain Current(Tc=125℃) Gate-Body Leakage Current Gate Threshold Voltage
Drain-Source On-State Resistance Forward Transconductance
VGS=0V ID=250μA 80 -- -- V VDS=80V,VGS0V -- -- 1 =μA =μA VDS=80V,VGS0V -- -- 10 VGS=±20V,V=DS0VVDS=VGS,ID=250μA
-- -- ±100 nA 2 3 4 V VGS(TH) RDS(ON)
VGS=10V, I=mΩ D40A -- 8 11 D35A -- 28 -- =S VDS= 50V, I
gfs
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise stated)
Ciss Coss Crss Qg Qgs Qgd
Input Capacitance Output Capacitance
Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDS=40V,ID=40A, VGS=10V VDS=40V,VGS=0V, f=1MHz
-- --
3300 430
-- --
pF pF
-- 160 -- pF -- --
85 16
-- --
nC nC
-- 22 -- nC Switching Characteristics
td(on) tr td(off) tf
Turn-on Delay Time
VDD=40V,
Turn-on Rise Time Turn-Off Delay Time Turn-Off Fall Time
ID=1A, RG=5Ω, VGS=10V
-- -- -- --
45 25 73 35
-- nS -- nS -- nS -- nS Source- Drain Diode Characteristics
ISD VSD trr
Notes:
Source-Drain Continuous Current Forward on voltage, Tj=25℃, Reverse Recovery Time, Tj=25℃
Tc=25℃ -- -- 80 A ISD=35A,V=1.3 V GS0V -- -- ,IF=40A,VDD=25V di/dt=100A/μs
-- 65 -- nS 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2.Starting TJ=25℃,L=0.5mH,RG=25Ω,ID=40A,VGS=10V
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上海万芯电子科技有限公司Shanghai WanXin Technology and Electronic Co..Ltd80N08ATD
80V/80A N-Channel Advanced Power MOSFET
Electrical Characteristics
A)( tnerurC niarD - DI.
Tj - Junction Temperature (°C)
Fig1. Drain Current Vs Junction Temperature
A)( tnerurC niarD - DIVDS - Drain-Source Voltage (V) Fig3. Output Characteristics V)(egatloV dlohserhT etaG dezilamroN
Tj - Junction Temperature (°C)
Fig5. Normalized Gate Threshold Voltage Current Vs Junction Temperature
)W(rewoP-totPTj - Junction Temperature (°C) Fig2.Power Dissipation
Ω)m( ecnatsiseR - nO -)NO(SDR
IDS - Drain-Source Current (A) Fig4. RDS(ON) Vs. IDS Curve
A)( tnerurC niarD - DIGate Voltage (V)
Fig6. Transfer characteristics
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上海万芯电子科技有限公司Shanghai WanXin Technology and Electronic Co..Ltd80N08ATD
80V/80A N-Channel Advanced Power MOSFET
Electrical Characteristics
SSDBV dezilamroNTj - Junction Temperature (°C)
Fig7. Normalized BVDSS vs Temperature
V) ( egatlov ecruoS-etaG
Gate charge (nC)
Fig9. Gate Charge VS Gate-Source voltage
Fig11.Avalanche Test Circuit and Waveforms
)Fpe(cnaticapaCVDS - Drain-Source Voltage (V) Fig8. Capacitance variations
N)O(SDR dezilamroNTj - Junction Temperature (°C) Fig10. RDS(ON) VS Junction Temperature
Fig12.Switching Time Test Circuit and
Waveforms
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上海万芯电子科技有限公司Shanghai WanXin Technology and Electronic Co..Ltd80N08ATD
80V/80A N-Channel Advanced Power MOSFET
TO-263 Package Outline
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