Multilayer circuit board fabrication process

专利名称：Multilayer circuit board fabrication process发明人：Harold Lake,Paul E. Grandmont申请号：US06/742747申请日：19850610公开号：US04915983A公开日：19900410

摘要：A process for making additive multilayer circuit boards uses separatelydesigned and fabricated composite structures each consisting of a patterned conductivemetal foil supported by a photo-processible insulating film. The composite is bonded foilpattern side down to the substrate or pre-existing multilayer structure and selectedareas of the insulating film are removed down to underlying metal sites for electrolessplating. All of the apertures in the insulating film are then electrolessly plated full ofmetal flush to the upper surface. Additional patterned composites are applied andplated up as desired to create blind vias and new conductor patterns layer by layer. In analternate process a foil clad composite is bonded to an existing substrate foil side up.The insulating layer is selectively etched through windows photoetched in the foil layer.The voids in the insulator layer expose copper sites on the underlying composite. Thevoids are plated full of metal to form vias and the foil layer is photoetched to make aconductor pattern. The process is repeated to make a multilayer PWB.

申请人：THE FOXBORO COMPANY

代理机构：Fish & Richardson

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