专利名称：Circuit board for semiconductor package发明人：Choon Heung Lee,Won Dai Shin,Chang Hoon
Ko,Won Sun Shin,Seon Goo Lee,Won KyunLee,Tae Hoan Jang,Jun Young Yang
申请号：US09648946申请日：20000823公开号：US06469258B1公开日：20021022
专利附图：
摘要：A circuit board for semiconductor package is designed to provide a completegrounding with corresponding equipment in the manufacture of the semiconductor
package based on a circuit board, thereby preventing a breakdown of the circuit board orsemiconductor chip caused by electrostatic charges. The printed circuit board for
semiconductor package includes: a resinous substrate; a chip mounting region formed onthe top surface of the resinous substrate for mounting a semiconductor chip thereon; aplurality of fine circuit patterns radially disposed in the circumference of the chipmounting region and extending to the edge of the chip mounting region; a plurality ofball lands formed in an array on the bottom surface of the resinous substrate, to befused to conductive balls; a conductive via hole connecting the circuit patterns on the topsurface of the resinous substrate to the ball lands on the bottom surface of the resinoussubstrate; a cover coat applied to the top and bottom surfaces of the resinous substrateto protect the circuit patterns from an external environment and make the ball landsopen to the exterior; and a means for removing electrostatic charges provided at theedge of the substrate and connected to the plural circuit patterns to removeelectrostatic charges in the manufacture of semiconductors.
申请人：AMKOR TECHNOLOGY, INC.,AMKOR TECHNOLOGY KOREA, INC.
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