Packaging Structure and Method

专利名称：Packaging Structure and Method发明人：Nazir Ahmad,Young-Do Kwon,Samuel

Tam,Kyung-Moon Kim,Rajendra D. Pendse

申请号：US13245181申请日：20110926

公开号：US20120217635A9公开日：20120830

专利附图：

摘要：A method of making a semiconductor device includes providing a substrate andforming a conductive layer on the substrate. The conductive layer includes a first metal. Asemiconductor die is provided. A bump is formed on the semiconductor die. The bump

includes a second metal. The semiconductor die is positioned proximate to the substrateto contact the bump to the conductive layer and form a bonding interface. The bump andthe conductive layer are metallurgically reacted at a melting point of the first metal todissolve a portion of the second metal from an end of the bump. The bonding interface isheated to the melting point of the first metal for a time sufficient to melt a portion ofthe first metal from the conductive layer. A width of the conductive layer is no greaterthan a width of the bump.

申请人：Nazir Ahmad,Young-Do Kwon,Samuel Tam,Kyung-Moon Kim,Rajendra D.Pendse

地址：San Jose CA US,Cupertino CA US,Daly City CA US,Kyoung ki-do KR,Fremont CAUS

国籍：US,US,US,KR,US

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