HIGH DENSITY THREE-DIMENSIONAL ELECTRICAL INTERCON
来源：锐游网
专利内容由知识产权出版社提供
专利名称：HIGH DENSITY THREE-DIMENSIONAL
ELECTRICAL INTERCONNECTIONS
发明人：Xuejin Wen,Peter J. Nystrom,Gary D.
Redding,Jun Ma
申请号：US13614879申请日：20120913
公开号：US20140071208A1公开日：20140313
专利附图：
摘要：Implementations relate to methods, devices produced by the method, andsystems using the devices, for forming three-dimensional interconnect structures for ink
piezoelectric printheads.
申请人：Xuejin Wen,Peter J. Nystrom,Gary D. Redding,Jun Ma
地址：Fairport NY US,Webster NY US,Victor NY US,Penfield NY US
国籍：US,US,US,US
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