HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE A

专利名称：HEAT DISSIPATION STRUCTURE FOR

ELECTRONIC DEVICE AND FABRICATIONMETHOD THEREOF

发明人：Ra-Min Tain,Ming-Ji Dai,Yon-Hua Tzeng申请号：US13332144申请日：20111220

公开号：US20120092834A1公开日：20120419

专利附图：

摘要：A heat dissipation structure for an electronic device includes a body having afirst surface and a second surface opposite to the first surface. A silicon-containing

insulating layer is disposed on the first surface of the body. A chemical vapor deposition(CVD) diamond film is disposed on the silicon-containing insulating layer. A first

conductive pattern layer is disposed on the silicon-containing insulating layer, wherein thefirst conductive pattern layer is enclosed by and spaced apart from the CVD diamondfilm. A method for fabricating a heat dissipation structure for an electronic device and anelectronic package having the heat dissipation structure are also disclosed.

申请人：Ra-Min Tain,Ming-Ji Dai,Yon-Hua Tzeng

地址：New Taipei City TW,Hsinchu City TW,Changhua County TW

国籍：TW,TW,TW

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