专利名称:DUAL TEMPERATURE HEATER发明人:Dale R. Du Bois,Juan Carlos Rocha-Alvarez,Sanjeev Baluja,GaneshBalasubramanian,Lipyeow Yap,JianhuaZhou,Thomas Nowak
申请号:US12851794申请日:20100806
公开号:US20110034034A1公开日:20110210
专利附图:
摘要:A method and apparatus for heating a substrate in a chamber are provided. an
apparatus for positioning a substrate in a processing chamber. In one embodiment, theapparatus comprises a substrate support assembly having a support surface adapted toreceive the substrate and a plurality of centering members for supporting the substrateat a distance parallel to the support surface and for centering the substrate relative to areference axis substantially perpendicular to the support surface. The plurality of thecentering members are movably disposed along a periphery of the support surface, andeach of the plurality of centering members comprises a first end portion for eithercontacting or supporting a peripheral edge of the substrate.
申请人:Dale R. Du Bois,Juan Carlos Rocha-Alvarez,Sanjeev Baluja,GaneshBalasubramanian,Lipyeow Yap,Jianhua Zhou,Thomas Nowak
地址:Los Gatos CA US,San Carlos CA US,Campbell CA US,Sunnyvale CA US,Santa ClaraCA US,San Jose CA US,Cupertino CA US
国籍:US,US,US,US,US,US,US
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